OPTO-SEMICONDUCTOR PRODUCTS
9
News 2014 Vol. 2
NEW
MPPC, MPPC Array
S12641/S12642/S12892/S12894 Series
Academic Res.
ND Inspection
Industry
Security
Optical Comms
Semicon Prod.
Analytical
Measurement
Drug Discovery
Life Science
Medical
MPPC formable into large sensitive areas with small
dead space by narrow-pitch tiling
These MPPCs use through-silicon via (TSV) to minimize non-sensitive portions
around the photosensitive area. The 4-side buttable structure allows arraying
of multiple MPPC elements in two dimensions at narrow intervals.
Features
COB (chip on board) package with minimal dead space
Tiling forms a large sensitive area
Low afterpulse
Excellent uniformity
S12641PA-50, S12642-0404PA-50
Specifications
Type No.
Effective
photosensitive area
Pixel pitch Coating
Package
S12892PA-50
2 mm x 2 mm
50 μm
Resin
(100 µm)
Surface mount type
S12641PA-50
3 mm x 3 mm
S12894PA-50
6 mm x 6 mm
S12642-0404PA-50
3 mm x 3 mm
(4 x 4 ch array)
50 μm
Surface mount type
S12642-0404PB-50
With connector
S12642-0808PA-50
3 mm x 3 mm
(8 x 8 ch array)
Surface mount type
S12642-0808PB-50
With connector
S12642-1616PA-50
3 mm x 3 mm
(16 x 16 ch array)
Thin film
(20 µm)
Surface mount type
S12642-1616PB-50
With connector
Board
MPPC chip
Solder bump
Structure
Board
Chip
Solder bump
Photosensitive area
Contact pad
(or connector)
Photosensitive area
from the board
Between photosensitive
areas
0.2
0.2
(Unit: mm)
Transparent
resin
Details around package (array type)
