Hamamatsu News 2 / 2017

OPTO-SEMICONDUCTOR PRODUCTS 16 News 2017 Vol. 2 New ND Inspection Industry Security Optical Comms Semicon Prod. Analytical Measurement Drug Discovery Life Science Medical Academic Res. Near infrared image sensors for portable analytical instruments The compact and low-cost near infrared linear image sensors are designed for portable analytical instruments. They consume less current than the previous product (DIP package products: G11620 series). Further, because they employ a compact LCC package with a flexible board, they are suitable for integration into compact thin devices. Features „ „ Compact (with flexible board) „ „ 3.3 V drive „ „ Low current consumption: 15 mA (G13913-128FB) „ „ Low cost „ „ 128 pixels (50 x 250 μm/pixel): G13913-128FB „ „ 256 pixels (25 x 250 μm/pixel): G13913-256FG Applications „ „ Portable analytical instruments G13913-128FB/-256FG Specifications (Comparison with the DIP package product) Parameter New LCC package G13913-256FG DIP package G11620-256DF Unit Spectral response range 0.95 to 1.7 μm Number of pixels 256 256 pixels Pixel size (H x V) 25 x 250 25 x 500 μm Supply voltage 3.3 5 V Consumption current 20 50 mA Readout noise* 1 150 200 μV rms Saturation output voltage 2.2 2.8 V Dark current* 1 ±1 ±0.5 pA Package size 13.5 x 5.2 x 2.05 31.8 x 15.1 x 3.0 mm *1 CE=16 nV/e - , t=10 ms Dimensional outline (unit: mm) 13.50 5.20 20.00 7.50 0.50 0.30 ± 0.05 4.80 ± 0.30 1.50 ± 0.15 0.55 ± 0.05 Flexible board Window Wire bonding Photosensitive surface CMOS chip Bump bonding Index mark Reinforcing plate Dimensional outline (Unit: mm) New LCC package G13913-256FG DIP package G11620-256DF InGaAs Linear Image Sensors G13913-128FB/-256FG